Title:
導電接続材料及び太陽電池セル
Document Type and Number:
Japanese Patent JP7499073
Kind Code:
B2
Abstract:
To provide a conductive connection material which enables formation of a conductive pattern having low resistance on a surface of an insulation material.SOLUTION: A conductive connection material contains solder particles, conductive particles covered with metal not melted in a use temperature area, and a thermosetting resin having a curing temperature lower than a melting point of the solder particles.SELECTED DRAWING: None
Inventors:
Shinpei Okamoto
Junichi Nakamura
Junichi Nakamura
Application Number:
JP2020096878A
Publication Date:
June 13, 2024
Filing Date:
June 03, 2020
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
H01L31/0224; H01B1/22; H01L31/0747; H05K1/09
Domestic Patent References:
| JP9293952A | ||||
| JP2017224602A | ||||
| JP2005071825A | ||||
| JP2019141878A | ||||
| JP2000353424A | ||||
| JP2015511888A | ||||
| JP2013073890A |
Foreign References:
| KR1020110017642A | ||||
| US20150034141 |
Attorney, Agent or Firm:
Yuichi Niiyama
Ryuta Kato
Ryuta Kato