Title:
導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法
Document Type and Number:
Japanese Patent JP7347618
Kind Code:
B2
Abstract:
A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.
Inventors:
Takashi Tachizawa
Kazuya Matsuda
Yutaka Tsuchida
Takashi Seki
Mitsuyoshi Shimamura
Kengo Shinohara
Tetsuyuki Shirakawa
Yasunori Kawabata
Satoru Matsumoto
Kazuya Matsuda
Yutaka Tsuchida
Takashi Seki
Mitsuyoshi Shimamura
Kengo Shinohara
Tetsuyuki Shirakawa
Yasunori Kawabata
Satoru Matsumoto
Application Number:
JP2022158508A
Publication Date:
September 20, 2023
Filing Date:
September 30, 2022
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C09J7/30; B32B7/025; C09J7/40; C09J9/02; H01B1/22
Domestic Patent References:
| JP3285977A | ||||
| JP2009004767A | ||||
| JP11092716A | ||||
| JP2004277573A | ||||
| JP2007246551A | ||||
| JP2010523841A |
Foreign References:
| US20050255275 | ||||
| WO2018066411A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Kouichi Osaka
Yoshinori Shimizu
Hiroyuki Hirano
Kouichi Osaka