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Title:
CONDUCTIVE AND MAGNETIC RESIN GRAIN
Document Type and Number:
Japanese Patent JPS6083304
Kind Code:
A
Abstract:

PURPOSE: To make mutual contact of both powders sufficient by spreading conductive powder and ferrite powder of 1/10W1/1,000 diameter of resin grain on the surface of the resin grain and heating integrally.

CONSTITUTION: On the surface of an adhesive resin 11 which formes a mutualy affinitive coating film or an adhesive film on the polymer surface due to caking after melting such as polyorefin resin, conductive powder and ferrite powder 12 of 1/10W1/1,000 diameter of the resin 11 grain spread and caked. Then, if the resin grain 11 which is caked with the conductive powder and the ferrite powder 12 on the surface is heated integrally, the conductive powder and the ferrite powder 12 are connected continuously and a continuous conductive route or a continuous magnetic pass 13 can be formed.


Inventors:
HAYASHI TOORU
CHIYOUKAI YASUO
MORISHITA TOSHIO
MASUO KAZUHIKO
Application Number:
JP19200983A
Publication Date:
May 11, 1985
Filing Date:
October 13, 1983
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C08K9/00; C08J3/12; C08K9/08; C08K9/12; C08L7/00; C08L21/00; C08L23/00; C08L51/00; C08L51/02; C08L101/00; H01B1/20; H01F1/00; H01F1/113; H01Q17/00; (IPC1-7): C08J3/12; C08K9/12; H01B3/00; H01F1/00; H01Q17/00
Attorney, Agent or Firm:
Akira Wada



 
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