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Title:
CONDUCTIVE MATERIAL
Document Type and Number:
Japanese Patent JP2015004016
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive paste and a conductive film which have a low volume resistivity even in a low-temperature firing process and are excellent in heat resistance and adhesiveness.SOLUTION: A conductive paste and a conductive film use at least a phenolic hydroxy group-containing aromatic polyamide resin as a binder resin. The phenolic hydroxy group-containing aromatic polyamide resin represented by following formula (1), (where m and n represent average values and satisfy 0

Inventors:
ISHIKAWA KAZUNORI
MIZUTANI TAKESHI
SEGAWA JUNICHI
Application Number:
JP2013131065A
Publication Date:
January 08, 2015
Filing Date:
June 21, 2013
Export Citation:
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Assignee:
NIPPON KAYAKU KK
International Classes:
C08L77/10; C08G69/32; C08K3/08; C08L63/00; H01B1/00; H01B1/22
Domestic Patent References:
JPH11195326A1999-07-21
JP2001031784A2001-02-06
JP2002368043A2002-12-20



 
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