Title:
CONDUCTIVE MATERIAL, MOLDED ARTICLE AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2022148743
Kind Code:
A
Abstract:
To provide a conductive material having good resin adhesion, a molded article, and an electronic component.SOLUTION: There is provided a conductive material in which a resin is molded on a surface or the surface is sealed with a resin, wherein the surface is composed of metal, a minimum autocorrelation length Sal on the surface is 5.0 μm or less, and a surface area ratio Sratio is 1.3 or more.SELECTED DRAWING: Figure 5
Inventors:
TAKAHASHI YUTAKA
KAWAMURA TAKAHIRO
SASAKI YASUNORI
KOBAYASHI YOSHIAKI
KAWAMURA TAKAHIRO
SASAKI YASUNORI
KOBAYASHI YOSHIAKI
Application Number:
JP2021050546A
Publication Date:
October 06, 2022
Filing Date:
March 24, 2021
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
H01L23/50; C23C18/32; C23C18/38; C23C18/42; C25D7/12
Attorney, Agent or Firm:
Axis International Patent Business Corporation
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