PURPOSE: To provide a package for inserting a board in each recessed part thereof and protecting the board from static electricity and outer impact, by forming a cushion package with recessed and projected shapes alternately when air is injected through a valve.

CONSTITUTION: When air is injected through an air-injecting valve 3 in a conductive tube 2, a package swells to form a recessed part and a projected part, where a board 1 is mounted in a recessed groove between these projected parts. Since the boards 1 are mounted in each recessed part formed by the swollen conductive tube 2, they are carried safely while each board with a semiconductor component 5 thereon is protected from static electricity and outer impact. In this way, any semiconductor element with various shapes is fitted firmly in the recessed part of the swollen conductive tube 2 and endure the outer impact. At the same time, the package has a grounded structure and the semiconductor can be protected from static electricity.