To provide a conductive particle having a small amount of thermal shrinkage in baking, and to provide a reliable electronic component having a conductive layer formed by baking the conductive particle.
The surface of a mother particle 2 made of barium titanate (BaTiO3) is coated with a covering layer 3 made of nickel to manufacture the conductive particle 1. The diameter of the conductive particle 1 is set to 0.1-1 micron, for example 0.2 micron; the diameter of the mother particle 2 is set to approximately 80% of that of the conductive particle 1; and the thickness of the covering layer 3 is set to approximately 10% of the diameter of the conductive particle 1. The conductive particle 1 is mixed with an organic vehicle to prepare the conductive paste, and the conductive paste is applied to a ceramic green sheet, which is laminated and baked, thus manufacturing MLCC. In this case, the covering layers 3 are connected to form a current path. However, the mother particles 2 are hardly deformed, thus restraining thermal shrinkage.
HATAKE KOTARO
| JPH06168620A | 1994-06-14 | |||
| JP2002334611A | 2002-11-22 |
| WO2004066319A1 | 2004-08-05 |
Masatake Shiga
Yasuhiko Murayama
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