Title:
導電性粒子、導電材料及び接続構造体
Document Type and Number:
Japanese Patent JP6491446
Kind Code:
B2
Inventors:
Keizo Nishioka
Masao Sasahira
Masao Sasahira
Application Number:
JP2014198472A
Publication Date:
March 27, 2019
Filing Date:
September 29, 2014
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01B5/00; H01B1/00; H01B1/22; H01R11/01
Domestic Patent References:
| JP2006351508A | ||||
| JP2013020721A | ||||
| JP2010086664A | ||||
| JP2004362838A |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office