To provide conductive fine particles with excellent connection reliability while achieving low profile and narrow area by securing a joint area of an electrode of a semiconductor chip or an electronic component and an electrode of a mounted substrate, and to provide a method for manufacturing the conductive particles and a conductive connection structure.

In the conductive fine particles connecting the electrode of the semiconductor chip or the electronic component and the electrode of the mounted substrate, metal layers are formed in surfaces of prismatic resin fine particles, and the resin fine particles are made of an organic compound cured by irradiation of an energy beam and/or heating.