To provide a conductive paste composition which can be filled in a via hole by an ordinary printing method, which is preferable in terms of reduction in an environmental load, which has no via failure, which is excellent in reliability of connection of a via, and which can reduce a resistance value of the via to a large extent.
A via filling conductive paste composition of a multilayer wiring board contains conductive powder and a binder component at a predetermined mass ratio. The conductive powder is a non-lead solder particle having a melting point of 130C or more and 240C or less (a first alloy particle) and at least one or more kinds selected from a group of Au, Ag, and Cu (a second metal particle). The first alloy particle and the second metal particle are present at a predetermined mass ratio. The binder component is a thermoplastic resin composition having Tg lower than the melting point of the first alloy particle and a flow beginning temperature of 260C or more.
MATSUI JUN
Akihiko Yamashita
Kishimoto Tatsuto
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