Title:
CONDUCTIVE PASTE AND FORMATION METHOD OF CONDUCTIVE PATTERN
Document Type and Number:
Japanese Patent JP2018129310
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive paste and a formation method of conductive pattern, which can form a fine conductive pattern having sufficient conductivity and excellent adhesiveness with a substrate.SOLUTION: A production method of a conductive paste includes: a first previous step of preparing a mixed liquid of a silver compound capable of generating metallic silver by decomposing by reduction and amine; a second previous step of generating silver fine particles to at least a part of a surface of which amine adheres by reducing the silver compound in the mixed liquid; and a step of dispersing the fine silver particles in an organic solvent containing a low swelling organic solvent of which blanket swelling rate is 2.0 wt.% or smaller, in which a content of the low swelling organic solvent is set to 3.0 to 30 wt.%.SELECTED DRAWING: None
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Inventors:
SHINTANI YUKI
TONOMURA TAKUYA
TONOMURA TAKUYA
Application Number:
JP2018080561A
Publication Date:
August 16, 2018
Filing Date:
April 19, 2018
Export Citation:
Assignee:
BANDO CHEMICAL IND
International Classes:
H01B13/00; B22F1/00; B22F1/02; B22F9/24; H01L21/28; H01L21/288; H05K1/09; H05K3/12
Domestic Patent References:
| JP2015536385A | 2015-12-21 |
Attorney, Agent or Firm:
Koichi Naka
Yoshiaki Morisada
Yoshiaki Morisada