To provide a conductive paste for a laminated ceramic electronic component capable of being superior at a lamination property and an adhesive property of a green sheet even when strength of the ceramic green sheet is weak by reducing the thickness of the ceramic green sheet and furthermore, respective binders included in the green sheet and an internal electrode pattern layer are a combination of mutually non-compatible binders and effectively preventing a position gap and delamination at the time of lamination of the green sheet, and cracks and a delamination phenomenon after calcination.
The conductive paste includes the binder A, a tackifier B, a solvent C with the boiling point of 300C at normal pressure, conductive powder D, and ceramic powder E.
MIURA SHUICHI
ODA KAZUHIKO
| JP2007165753A | 2007-06-28 | |||
| JP2004186339A | 2004-07-02 |
Toru Suzuki