Title:
CONDUCTIVE PASTE AND NONCONTACT IC CARD WITH PRINTED ANTENNA CIRCUIT USING THE PASTE
Document Type and Number:
Japanese Patent JPH1196833
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide conductive paste requiring short time for drying and curing and a low drying temperature, and capable of improving such matters as a circuit crash at an IC connection time through an anisotropic conductive film and the drying property of the paste at a screen printing time. SOLUTION: Conductive paste comprises (A) planarized silver powder or a mixture of the planarized silver powder and planarized silver-plated copper powder, (B) thermoplastic resin having a penetration amount of 30 μm or less up to 100 deg.C measured using a thermo-mechanical measuring device, and (C) mixed solvent of at least one kind or more of organic solvent at 200 deg.C or more in boiling point and at least one kind or more of organic solvents at 190 deg.C or less in boiling point.
Inventors:
ONOSE KATSUHIRO
UEHARA HIDEAKI
UEHARA HIDEAKI
Application Number:
JP25114897A
Publication Date:
April 09, 1999
Filing Date:
September 16, 1997
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09D5/24; G06K19/07; G06K19/077; H01B1/22; H05K1/09; (IPC1-7): H01B1/22; C09D5/24; G06K19/07
Attorney, Agent or Firm:
Hotaka Tetsuo