PURPOSE: To strengthen bond between conductive fibers so as to reduce the quantity of mixture of conductive fibers by using conductive fibers and low melting point metal at the same time as conductive fillers, and further adding heavy metal deactivator to a cover resin layer.
CONSTITUTION: A conductive resin composition causing no deterioration, even at high temperature in conductivity and mechanical strength of a mold can be gotten by integrally applying a thermoplastic resin layer (D) containing a heavy metal deactivator (C) on the surface of conductive fillers consisting of long conductive fibers (A) and low melting point metal (B) and then cutting them into pellet shapes. As the heavy metal deactivator, m-nitrobenzehydrazide, 3-amino-1,2,4-triazole, benzotriazole, etc., can be cited. By the addition of this heavy metal deactivator, the deterioration by the conductive fibers in the thermoplastic resin can be prevented, and degradation of the essential mechanical properties of the resin can be suppressed.
| JPH09199884 | MAGNETIC SHIELD PANEL |
| JP3927966 | SURFACE MOUNTING CLIP |
FUKUMOTO HIROAKI
HABATA KEIICHI
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