PURPOSE: To obtain composition having excellent aging stability without deterioration of conductivity even in a high temperature environment by so selectively setting the melting point of polyamide resin covering the surface of a conductive filler as to become lower than that of low melting point metal and that of a crystalline thermoplastic pellet.
CONSTITUTION: Conductive fiber such as copper fiber, etc. is gathered as low melting point metal as conductive filler, the surface is covered with polyamide resin as thermoplastic resin to be integrated, and cut in a pelletlike state as a master pellet. As the low melting point metal, Sn or Sn-Pb solder, etc. is used solely or mixture, and low melting point metal to be melted at the temperature of a heating cylinder of an injection molding machine and having slightly higher melting point than that of the polyamide such as nylon, etc. is selectively set. Thus, mutual solubility of the crystalline thermoplastic pellet and the thermoplatic resin for the filler is satisfactory, no deterioration in the conductivity occurs even in a high temperature environment, and composition having excellent aging stability is obtained.
FUKUMOTO HIROAKI
HABATA KEIICHI
| JPS63218309A | 1988-09-12 | |||
| JPS63251440A | 1988-10-18 |