Title:
三次元成形用導電性シート
Document Type and Number:
Japanese Patent JP7080183
Kind Code:
B2
Abstract:
A conductive sheet for three-dimensional molding, having: a pseudo sheet structure having an a plurality of conductive linear bodies extending in one direction and being arranged so as to maintain a prescribed distance between adjacent conductive linear bodies of 0.3–12.0 mm; a resin protective layer provided on one surface of the pseudo sheet structure; and an adhesive layer provided between the pseudo sheet structure and the resin protective layer.
Inventors:
Masaharu Ito
Inoue Kazan
Inoue Kazan
Application Number:
JP2018553022A
Publication Date:
June 03, 2022
Filing Date:
November 28, 2017
Export Citation:
Assignee:
Lintec of America, Inc.
International Classes:
H05B3/20
Domestic Patent References:
JP2016143538A | ||||
JP2016022857A | ||||
JP47005591B1 | ||||
JP5032954Y2 | ||||
JP2004238509A | ||||
JP5013157A |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office
Previous Patent: Nozzle / header design for polystyrene
Next Patent: Method for enhancing gene delivery
Next Patent: Method for enhancing gene delivery