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Patent Searching and Data


Title:
三次元成形用導電性シート
Document Type and Number:
Japanese Patent JP7080183
Kind Code:
B2
Abstract:
A conductive sheet for three-dimensional molding, having: a pseudo sheet structure having an a plurality of conductive linear bodies extending in one direction and being arranged so as to maintain a prescribed distance between adjacent conductive linear bodies of 0.3–12.0 mm; a resin protective layer provided on one surface of the pseudo sheet structure; and an adhesive layer provided between the pseudo sheet structure and the resin protective layer.

Inventors:
Masaharu Ito
Inoue Kazan
Application Number:
JP2018553022A
Publication Date:
June 03, 2022
Filing Date:
November 28, 2017
Export Citation:
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Assignee:
Lintec of America, Inc.
International Classes:
H05B3/20
Domestic Patent References:
JP2016143538A
JP2016022857A
JP47005591B1
JP5032954Y2
JP2004238509A
JP5013157A
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office