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Title:
CONDUCTIVE SILVER PASTE
Document Type and Number:
Japanese Patent JP2012248370
Kind Code:
A
Abstract:

To provide a conductive silver paste which allows a resistance value to be sufficiently lowered by a heating process for a short time, while having a certain viscosity.

The conductive silver paste contains silver powder, epoxy resin and curing agent, in which a mixing ratio of the curing agent is 0.3-1.5 parts by weight with respect to 1 part by weight of the epoxy resin. The silver powder content is preferably 2000-4000 parts by weight with respect to 100 parts by weight of the epoxy resin. More preferably, the curing agent is at least one kind selected from the group consisting of amine-based curing agent, urea-based curing agent, acid anhydride-based curing agent and aromatic amine-based curing agent.


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Inventors:
NISHIKAWA MARIE
SHIODA SATOSHI
HOJO MIKIKO
SATO TAKESHI
Application Number:
JP2011118200A
Publication Date:
December 13, 2012
Filing Date:
May 26, 2011
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
DNP FINE CHEMICALS CO LTD
International Classes:
H01B1/22; H01B13/00; H05K3/12
Domestic Patent References:
JP2009024149A2009-02-05
JP2005225980A2005-08-25
JP2006049148A2006-02-16
JP2005264095A2005-09-29
JP2001107020A2001-04-17
JP2009070677A2009-04-02
JP2005171170A2005-06-30
Attorney, Agent or Firm:
Patent Business Corporation Saegusa International Patent Office



 
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