Title:
導電性基板およびその製造方法ならびにタッチパネル
Document Type and Number:
Japanese Patent JP4888608
Kind Code:
B2
Abstract:
One embodiment of the present invention is a conductive substrate including: a conductive layer, and a transparent conductive layer on at least one surface of a transparent substrate in this order from the transparent substrate side. According to the present invention, it becomes possible to provide a conductive substrate, wherein positioning of the transparent conductive layer and the metal wiring is easy, a method of manufacturing thereof, and a touch panel, even in the conductive substrate where the shape of the transparent conductive layer pattern is inconspicuous.
Inventors:
Yu Kobayashi
Noritoshi Tomikawa
Noritoshi Tomikawa
Application Number:
JP2011148951A
Publication Date:
February 29, 2012
Filing Date:
July 05, 2011
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
H01B5/14; B32B7/02; G06F3/041; G06F3/044; H01B13/00
Foreign References:
| WO2006028131A1 |