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Title:
CONDUCTIVE THICK FILM FOR HIGH FREQUENCY PARTS
Document Type and Number:
Japanese Patent JPH04149007
Kind Code:
A
Abstract:

PURPOSE: To obtain a conductive thick film for high frequency parts with low surface resistance by forming a conductive thick film on a substrate in a manner that the surface layer of the film consists of a mixture layer of metal and oxide superconductor with a specified thickness range.

CONSTITUTION: A mixture layer of metal (e.g. a noble metal essentially comprising Ag namely, silver alloy containing 3at.% of Pt,) and oxide superconductor (e.g. YBa2Cu3O7-x) is formed (3-20μm thickness) on a substrate (e.g. yttrium- stabilized zirconia) to obtain the conductive thick film for high frequency parts.


Inventors:
ISHII OSAMU
SATO MAKOTO
KOSHIMOTO YASUHIRO
KUWAJIMA HIDEJI
YAMANA SHOZO
Application Number:
JP27148990A
Publication Date:
May 22, 1992
Filing Date:
October 09, 1990
Export Citation:
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Assignee:
NIPPON TELEGRAPH & TELEPHONE
HITACHI CHEMICAL CO LTD
International Classes:
C04B35/00; C01B13/14; C01G1/00; C01G3/00; C04B35/45; H01B12/06; H01L39/06; H01P3/00; (IPC1-7): C01B13/14; C01G3/00; C04B35/00; H01B12/06; H01L39/06; H01P3/00
Attorney, Agent or Firm:
Masayoshi Amemiya