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Title:
導体パターン形成用インク、導体パターンおよび配線基板
Document Type and Number:
Japanese Patent JP4911004
Kind Code:
B2
Abstract:
A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; erythritol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following formula (I) is 0.15 to 0.80; H = OH ⁡ ( A ) Mw ⁡ ( A ) ⁢ X ⁡ ( A ) + OH ⁡ ( B ) Mw ⁡ ( B ) ⁢ X ⁡ ( B ) Formula ⁢ ⁢ ( I ) where OH(A) represents an average number of hydroxyl groups in one molecule of the polyglycerol compound, Mw(A) represents a weight-average molecular weight of the polyglycerol compound, X(A) represents a content of the polyglycerol compound in the conductive pattern forming ink in weight percent; and OH(B) represents a number of hydroxyl groups in one molecule of the erythritol, Mw(B) represents a molecular weight of the erythritol, and X(B) represents a content of the erythritol in the conductive pattern forming ink in weight percent.

Inventors:
Naoyuki Toyota
Application Number:
JP2007319016A
Publication Date:
April 04, 2012
Filing Date:
December 10, 2007
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
H01B1/22; B05D1/26; B05D5/12; B05D7/24; C09D11/00; C09D11/02; C09D11/023; C09D11/033; C09D11/52; H01B5/14; H05K1/09; H05K3/10
Domestic Patent References:
JP2004207558A
JP9176533A
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi