Title:
CONNECTING METHOD OF SURFACE MOUNT ELECTRODE COMPONENT AND THE SURFACE ELECTRODE COMPONENT
Document Type and Number:
Japanese Patent JP2000340943
Kind Code:
A
Abstract:
To connect a surface mount electrode component to a printed board at a normal position and in a normal state.
In order to connect a ceramic capacitor 10 to land 16 of a printed board 17, cream solder 15 is printed between a surface mount electrode 14 and the land 16. By selecting the height of the cream solder to be approximately 150 μm and selecting the height of the surface mount electrode 14 to be approximately 50 μm, fillets 15a and 15b wrapping the surface mount electrode 14 are produced of the melted cream solder so as to keep the ceramic capacitor 10 in a stable state.
Inventors:
IMAI YOSHIHIKO
Application Number:
JP14586299A
Publication Date:
December 08, 2000
Filing Date:
May 26, 1999
Export Citation:
Assignee:
SONY CORP
International Classes:
H01G4/12; H05K3/34; (IPC1-7): H05K3/34; H01G4/12; H05K3/34
Previous Patent: MOUNTING METHOD OF PACKAGED IC AND MOUNTING BOARD
Next Patent: HOT BLAST BLOW-OUT NOZZLE OF SOLDER MELTING DEVICE
Next Patent: HOT BLAST BLOW-OUT NOZZLE OF SOLDER MELTING DEVICE