Title:
CONNECTING STRUCTURE OF PRINTED BOARD WITH BACK BOARD PANEL
Document Type and Number:
Japanese Patent JPH01110796
Kind Code:
A
Abstract:
PURPOSE:To enable the connection of a printed board with a back board panel without using a connecting pin by a method wherein a conductor layer of a specified pattern is provided to the face of a printed substrate connecting jack on a back board panel side, a conductor layer is also provided to the face of the back board panel on the connecting jack side, and these two conductor layers are connected through a pressure welding. CONSTITUTION:A conductor layer 23 of a required pattern is provided to the face of a printed board connecting jack 21, which connects a printed board 27 and a jack board panel 22, on the back board panel 22 side, and a conductor layer 24 is also provided to the face of the back board panel 22 on the connecting jack 21 side so as to correspond to the above-mentioned conductor layer 23. These two conductor layers 23 and 24 are connected through a pressure welding for the connection of the back board panel 22 with the printed board 27. When the conductor layer pattern 23 formed on the jack 21 and the conductor layer pattern 24 formed on the back board panel 22 are made to be connected through pressure welding, for example, the space between a front board 28 of the printed board 27 and a frame provided with a rail is fixed with a fixing jig 31 provided with a built-in spring and L-shaped.
Inventors:
HONMA HITOSHI
Application Number:
JP26852187A
Publication Date:
April 27, 1989
Filing Date:
October 23, 1987
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K7/14; H05K3/32; H05K3/36; (IPC1-7): H05K7/14
Attorney, Agent or Firm:
Sadaichi Igita