CONNECTING STRUCTURE FOR WAVEGUIDE CHIP AND OPTICAL FIBER ARRAY

Title:

CONNECTING STRUCTURE FOR WAVEGUIDE CHIP AND OPTICAL FIBER ARRAY

Document Type and Number:

Japanese Patent JPH06186459

Kind Code:

A

Abstract:

PURPOSE: To provide the connecting structure of a waveguide chip and an optical fiber array whose optical coupling property is excellent.

CONSTITUTION: A joining boundary between the waveguide chip 1 and the optical fiber array 2 is inclined by a prescribed angle (θ) with respect to a vertical surface 7 to the optical axes of a waveguide 5 and an optical fiber 6 and light reflected on the joining boundary is deflected outside. Besides, engagement holes 8 are respectively formed on the joining surfaces 3 and 4 of the chip 1 and the array 2, and guide pins 9 are inserted in the holes 8. Then, relative movement between the inclined contact surface 3 and 4 is obstructed and the optical coupling property between the waveguide 5 and the fiber 6 is enhanced.

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Inventors:

YANAGAWA HISAHARU
SHIMIZU TAKEO
NAKAMURA SHIRO
WATANABE TOMOHIRO

Application Number:

JP35600692A

Publication Date:

July 08, 1994

Filing Date:

December 17, 1992

Export Citation:

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Assignee:

FURUKAWA ELECTRIC CO LTD

International Classes:

G02B6/36; G02B6/40; (IPC1-7): G02B6/40; G02B6/36

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