PURPOSE: To easily connect the electrodes of an integrated circuit element to opponent conductors by forming by plating outer and inner lead bumps at both ends of a finger lead.

CONSTITUTION: A tape carrier 1 is formed by laminating in advance the patterns of finger leads 2 to be connected to the electrodes 5 of an IC chip 4 on both side polyimide films. Windows are opened on both side faces to expose both ends of the lead 2. The exposed both ends are Ni-plated as diffusion preventive layers 21, then Au-plated on the Ni films, one of which becomes outer lead bumps 91 and the other of which becomes inner lead bumps 92. The electrodes 5 of the chip 4 are superposed on the bumps 91, conductors 8 to be connected are positioned on the bumps 92, and simultaneously connected by applying heat and pressure thereto by a bonding tool.