CONNECTION STRUCTURE OF HEAT INSULATING PANEL

Title:

CONNECTION STRUCTURE OF HEAT INSULATING PANEL

Document Type and Number:

Japanese Patent JP2010168820

Kind Code:

A

Abstract:

To improve the connection strength of a heat insulating panel, and to achieve smooth dismantling work when discarding the panel.

The heat insulating panel 12 includes a pair of surface materials 14, and a projected frame material 20 and/or a recessed frame material 30 provided over the entire width of the ends of the surface materials 14. A connecting member 40 for connecting them includes: an inner engaging portion 38 for removably engaging with the projecting-side engaged portion 26 of the projected frame material 20 on its inner surface; and an outer engaging portion 44 for removably engaging with the recessed-side engaged portion 36 of the recessed frame material 30 on its outer surface. The outer engaging portion 44 is always energized by elasticity in the direction engaging with the recessed-side engaged portion 36.

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Inventors:

KUBOTA TOSHIAKI
NOGAMI KENYA
OKADA JUNJI
KOIZUMI ISAO
KURODA YOSHINORI

Application Number:

JP2009012872A

Publication Date:

August 05, 2010

Filing Date:

January 23, 2009

Export Citation:

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Assignee:

SANYO ELECTRIC CO
SANYO SHOWA PANEL SYSTEM CO LTD

International Classes:

E04B1/80; E04B1/61; E04C2/38; E04C2/40

Domestic Patent References:

JP2008082070A	2008-04-10
JP2008082648A	2008-04-10

Attorney, Agent or Firm:

Kei Amekasa

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