Title:
CONNECTION STRUCTURE FOR PLANE TRANSMISSION LINE, AND SEMICONDUCTOR CHIP HAVING THE PLANE TRANSMISSION LINE AND MOUNT BOARD
Document Type and Number:
Japanese Patent JP2002033601
Kind Code:
A
Abstract:
To connect plane transmission lines formed on two dielectric materials with different dielectric constants.
In the case of connecting the plane transmission lines formed on two dielectric materials with different dielectric constants, a dielectric material thin film is formed only in the vicinity of the connected part and a line pattern is formed on the thin film. Thus, the effective dielectric constant of the connected part can be adjusted to have a desired value so as to relax a scale gap between the line on the mounted board and the line on a semiconductor chip. Thus, the impedance is easily matched to adopt a connection structure with a low reflection and a low loss.
Inventors:
UDA NAONORI
HOSHINO KOICHI
HOSHINO KOICHI
Application Number:
JP2000214820A
Publication Date:
January 31, 2002
Filing Date:
July 14, 2000
Export Citation:
Assignee:
TOYOTA CENTRAL RES & DEV
DENSO CORP
DENSO CORP
International Classes:
H01L23/12; H01P1/04; H01P3/02; H01P5/02; (IPC1-7): H01P1/04; H01L23/12; H01P3/02; H01P5/02
Attorney, Agent or Firm:
Fujitani Osamu