To provide a contact pin which can fulfill all five requirements: fine release characteristics from a solder ball, low electrical resistance (contact resistance and material resistance), high corrosion resistance and stable contact resistance, high hardness of parent material, and easy machining.
A contact pin 20 having a hybrid structure where a precious metal plating layer is formed on a surface of high silicon and extra low carbon stainless steel is a contact pin which is used by pressing a pin tip 22 against a solder ball. The contact pin 20 comprises: a contact pin body 30 manufactured from contact pin material made from the precipitation hardening type high silicon and extra low carbon stainless steel which has a Si (silicon) content within a range of 2-5 wt.% and a C (carbon) content of 0.03 wt.% or less as impurity; and a precious metal plating layer 32, which has a higher conductivity than that of the contact pin body 30, formed on a surface of the contact pin body 30.
HARA FUMITSUGU
HAYASHI YOSHIHIKO
LI NAN
WON CHANG WEI
SHIMIZU YOSHIYUKI
| JPH03180769A | 1991-08-06 | |||
| JP2009258100A | 2009-11-05 | |||
| JP2009138265A | 2009-06-25 | |||
| JP2005082892A | 2005-03-31 |
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