Title:
COOLING DEVICE FOR SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP2002261219
Kind Code:
A
Abstract:
To provide a cooling device, by which a semiconductor element is cooled effectively, which prevents the generation of damage in the semiconductor element and which can enhance the performance of the semiconductor element.
The cooling device 1 is provided with a housing chamber 9, which is constituted inside a heat insulating box body 6 and which is used to house boards 3 with attached semiconductor elements, a refrigerant circuit which is installed inside the machine chamber 37 of a body 9 and which is constituted of a compressor 38, a condenser 39, a pressure-reducing device, a cooler 21 and the like and a blower 22 with which cool air heat-exchanged with the cooler is circulated inside the housing chamber.
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Inventors:
AOKI HITOSHI
KUBOTA JUNICHI
KOMATSUBARA TAKEO
KAKINUMA HIROTAKA
MATSUOKA MASAYA
KUBOTA JUNICHI
KOMATSUBARA TAKEO
KAKINUMA HIROTAKA
MATSUOKA MASAYA
Application Number:
JP2001058869A
Publication Date:
September 13, 2002
Filing Date:
March 02, 2001
Export Citation:
Assignee:
SANYO ELECTRIC CO
International Classes:
F25D17/08; F25D11/00; H01L23/467; H05K7/20; (IPC1-7): H01L23/467; F25D11/00; F25D17/08; H05K7/20
Attorney, Agent or Firm:
Amasa Kei
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