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Title:
COOLING DEVICE
Document Type and Number:
Japanese Patent JP2008175448
Kind Code:
A
Abstract:

To provide a compact cooling device by a liquid cooling method having superior cooling performance.

A first flow channel portion 12 and a second flow channel portion 13 are formed on a part of a heat absorbing face 11b and a heat sink face 11a of a cooling portion 11 having a Peltier element, an outflow port of the first flow channel portion 12 and an inflow port of the second flow channel portion 13 are connected by a connection pipe 14, and a refrigerant flowing out from the first flow channel portion 12 flows into the second flow channel portion 13 through the connection pipe 14. By cooling the heat sink face 11a by the refrigerant cooled in the first flow channel portion 12, the cooling performance can be improved and the miniaturization of the device can be achieved.


Inventors:
NANBA OSAMU
Application Number:
JP2007008805A
Publication Date:
July 31, 2008
Filing Date:
January 18, 2007
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
F25B21/02; F25D17/02
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano



 
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