Title:
COOLING DEVICE
Document Type and Number:
Japanese Patent JP2804734
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To use even a water of worse quality onto a 1st order side by installing a heat exchanger to exchange and transfer the heat of a secondary cooling system to the primary cooling system.
SOLUTION: In a cooling device, a primary cooling system and a secondary cooling system 12 are installed. For example, a device to be cooled of a die device or a injection machine, etc., is cooled with the secondary cooling system 12, a heat exchanger 1 in order to exchange and transfer the heat of the secondary cooling system 12 to the primary cooling system is interposed between the primary cooling system and the secondary cooling system, and both cooling systems 11, 12 are connected mutually. The primary cooling system provides a discharge opening of a pump to send the cooling water, a discharge piping 7 to connect and connect through the primary side passage 6 of the heat exchanger 1, and a return piping 9 to return the cooling water being heat-exchanged at the heat exchanger 1 and being raised in the temperature to a cooling tower body. In the secondary cooling system 12, the heated water is returned in the return stream piping 19 to the high temperature H side of the tank 13. The water is sent with the pump 20 to the heat exchanger 1, and the cooled water is sent to the low temperature L side. Therefore, scale, rust and slime, etc., can be hardly generated inside the device to be cooled.
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Inventors:
Haruhisa Ikezoe
Application Number:
JP20641195A
Publication Date:
September 30, 1998
Filing Date:
July 19, 1995
Export Citation:
Assignee:
Shinsei Cooling Water System Co., Ltd.
International Classes:
B22D17/20; B21D37/16; B21J1/06; B22D17/22; B29C33/04; B29C45/72; (IPC1-7): B21D37/16; B21J1/06; B22D17/20; B22D17/22; B29C33/04; B29C45/72
Domestic Patent References:
| JP310181U |
Attorney, Agent or Firm:
Takeshi Nakatani