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Title:
COOLING METHOD OF ORGANIC EL ELEMENT
Document Type and Number:
Japanese Patent JP2004205937
Kind Code:
A
Abstract:

To provide a method of efficiently cooling an organic EL element supported by a support member.

In the method of cooling the organic EL element supported by the support member which supports the peripheral edge part of the organic EL element, an air duct passing through from the vicinity of the organic EL element to the outside of the support member is provided in the support member, and air is made to flow in the air duct to form an air stream on the surface of the organic EL element, and thus heat generated from the organic EL element is removed to cool the organic EL element. The organic EL element supported by the support member, especially, the organic EL element supported by the support member used for attaching the organic EL element to an attachment object material like a circuit board can be efficiently cooled, and reduction of luminance of the organic EL element and the occurrence of dark spots are suppressed, and even an organic EL element attached to a circuit board or the like having electronic parts densely arranged can be effectively cooled.


Inventors:
UTSUKI HIROYUKI
Application Number:
JP2002376923A
Publication Date:
July 22, 2004
Filing Date:
December 26, 2002
Export Citation:
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Assignee:
BRIDGESTONE CORP
International Classes:
H01L51/50; G09F9/00; G09F9/30; H01L27/32; H05B33/14; H01L51/52; (IPC1-7): G09F9/00; G09F9/30; H05B33/14
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi



 
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