Title:
電子機器の冷却構造
Document Type and Number:
Japanese Patent JP5192469
Kind Code:
B2
Abstract:
In an environment in which influence of heat energy from the outside is received, for example, when a large temperature difference occurs in an electronic equipment by external factors such as solar insolation or when a temperature difference occurs in the electronic equipment by heat of another device installed in the neighborhood, it is difficult to stabilize the temperature of the equipment within an allowable temperature range due to the influence of the external environment. An electronic equipment has a structure in which an electronic component contained in a housing is thermally connected to a housing inner wall through plural heat conduction members and a heat conduction control member, and the amount of heat transported from the electronic component to the housing inner wall is controlled by using the heat conduction control member. The amount of heat to be transported is decreased for a housing surface whose temperature rises by influence of the external environment, the amount of heat to be transported is increased for a housing surface which is not influenced by the external environment, and the temperature of the electronic component is stabilized within the allowable temperature range.
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Inventors:
Mitsuo Ishikura
Shinya Hamagishi
Nobuhiro Tamayama
Shinya Hamagishi
Nobuhiro Tamayama
Application Number:
JP2009227561A
Publication Date:
May 08, 2013
Filing Date:
September 30, 2009
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H05K7/20
Domestic Patent References:
| JP6209179A | ||||
| JP200157485A | ||||
| JP2006338846A |
Attorney, Agent or Firm:
Ken Hashizume
Koichi Kikuchi
Koichi Kikuchi