Title:
COPOLYESTER FOR HEAT-RESISTANT PACKAGING MATERIAL
Document Type and Number:
Japanese Patent JPH0297518
Kind Code:
A
Abstract:
PURPOSE:To improve heat resistance, gas barrier property, transparency and mechanical strengths by using a specific compd. as a comonomer. CONSTITUTION:By copolymerizing an acid component contg. at least 80mole% terephthalic acid, a glycol component contg. at least 80mole% ethylene glycol, and 3-20mole% (based on said acid component) compd. of the formula (wherein R1 and R2 are each H or 1-3C alkyl; R3 is H, or 1-10C alkyl, aralkyl or aryl), a copolyester for heat-resistant packaging material with a glass transition temperature of 83-90 deg.C and an intrinsic viscosity (in a mixed solvent of phenol/ tetrachloroethane in a wt. ratio of 60/40, 35 deg.C) of 0.4-1.0 is produced.
Inventors:
HIROSE MASAHIKO
KURATSUJI TAKATOSHI
KURATSUJI TAKATOSHI
Application Number:
JP24750688A
Publication Date:
April 10, 1990
Filing Date:
October 03, 1988
Export Citation:
Assignee:
TEIJIN LTD
International Classes:
C08G63/185; C08G63/181; (IPC1-7): C08G63/185
Attorney, Agent or Firm:
Maeda Junhiro
Next Patent: HIGHLY CRYSTALLINE POLYESTER COPOLYMER