Title:
COPPER ALLOY FOR SEMICONDUCTOR LEAD FRAME
Document Type and Number:
Japanese Patent JP2883524
Kind Code:
B2
Abstract:
PURPOSE: To produce a semiconductor lead frame in which the projective precipitation of Ag plating can be improved by the improvement of the copper alloy stock itself and the projective precipitation of the Ag plating is hard to cause.
CONSTITUTION: In a copper alloy for a semiconductor lead frame to be applied with Ag plating, the contents of Mg and Ca as impurity elements are regulated to, by weight, ≤10ppm Mg and ≤10ppm Ca. This copper alloy contains 1.0 to 3.0% Fe, 0.015 to 0.15% P, 0.05 to 0.20% Zn, and the balance copper with inevitable impurities, and furthermore, the one contg. 0.0010 to 0.020% Al in the copper alloy can be used.
Inventors:
MYATO MOTOHISA
NAKAJIMA YASUHIRO
ISONO MASAAKI
NAKAJIMA YASUHIRO
ISONO MASAAKI
Application Number:
JP24334093A
Publication Date:
April 19, 1999
Filing Date:
September 29, 1993
Export Citation:
Assignee:
KOBE SEIKOSHO KK
International Classes:
C25D3/46; C22C9/00; H01L23/48; H01L23/50; (IPC1-7): C22C9/00; H01L23/48; H01L23/50
Domestic Patent References:
| JP6369934A | ||||
| JP564224B2 |
Other References:
二塚錬成、「銅系リードフレーム材の開発動向と二，三の問題」、金属、株式会社アグネ、平成元年７月、第５９巻第７号、第７７−８５頁
黒柳卓、「最近の半導体パッケージ用銅合金材料の動向」、古河電工時報、昭和５５年７月、第１０３−１１３頁
黒柳卓、「最近の半導体パッケージ用銅合金材料の動向」、古河電工時報、昭和５５年７月、第１０３−１１３頁
Attorney, Agent or Firm:
Masanori Fujimaki