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Title:
COPPER ALLOY WIRE FOR METALLIC CONTAINER FOR STORING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP2008214692
Kind Code:
A
Abstract:

To provide a copper alloy wire for a metallic container for storing semiconductors which has excellent heat resistance, electrical conductivity (heat dissipation characteristics) and cold forgeability.

The copper alloy wire for a metallic container for storing semiconductors is a copper alloy wire having a composition consisting of, by mass, 0.2 to 1.1% Cr and the balance Cu with inevitable impurities or a copper alloy wire having a composition consisting of, by mass, 0.2 to 1.1% Cr, either or both of 0.1 to 1.0% Sn and 0.1 to 1.5% Zn and the balance Cu with inevitable impurities and is characterized in that: maximum elongation is 10%; electrical conductivity is 50% IACS; and hardness when heating is applied at 400C for 1 hr after cold forging is 135 Hv. This copper alloy wire is cut to a prescribed length, cold forged into a discoid body and further worked into a dish-like metallic container 1.


Inventors:
TAKAHASHI ISAO
UDA KATSUHIKO
Application Number:
JP2007053309A
Publication Date:
September 18, 2008
Filing Date:
March 02, 2007
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C22C9/00; H01L23/06; H01L23/373; H01L23/48
Domestic Patent References:
JP2001316741A2001-11-16
JP2005330583A2005-12-02
JPH05311364A1993-11-22
JP2006210575A2006-08-10
JP2001244390A2001-09-07