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Title:
COPPER-CLAD LAMINATED SHEET
Document Type and Number:
Japanese Patent JPS62225536
Kind Code:
A
Abstract:

PURPOSE: To obtain a copper-clad laminated sheet having excellent adhesivity to copper foil and high heat-resistance, by compounding a specific polybutadiene- epoxy resin with a compound composed of a cyanic acid ester and a bismaleimide and using the obtained composition solution as an impregnation varnish.

CONSTITUTION: The objective laminated sheet can be produced by (1) reacting (i) a terminal carboxyl-modified butadiene polymer containing ≥50% 1,2-butadiene unit having double bond on side chain in the polymer chain with (ii) 1.2W15 equivalent of an epoxy compound having ≥2 epoxy groups per 1mol based on 1 equivalent of the carboxyl group of the component (i), (2) diluting (A) 100pts.(wt.) of the obtained polybutadiene-epoxy resin and (B) 10W100pts. of a compound composed of a cyanic acid ester and bismaleimide with (C) an organic solvent, (3) adding an epoxy resin hardener and a polymerization catalyst to the solution to obtain an impregnation varnish, (4) impregnating a substrate with the impregnation varnish, (5) forming a prepreg sheet from the impregnated sheet and (6) laminating and hot-pressing a copper foil to the prepreg sheet.


Inventors:
MIYAMOTO FUMIYUKI
OKA SEIJI
DOI MAKOTO
NAKAJIMA HIROYUKI
CHIDAI HIDEKI
Application Number:
JP7024786A
Publication Date:
October 03, 1987
Filing Date:
March 28, 1986
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B32B7/02; B32B15/08; C08J5/24; H05K1/03; (IPC1-7): B32B7/02; B32B15/08; C08J5/24; H05K1/03
Attorney, Agent or Firm:
Masuo Oiwa