Title:
銅または銅合金板材およびその製造方法、ならびに端子
Document Type and Number:
Japanese Patent JP6856342
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide copper or a copper alloy plate material, a manufacturing method of the same, and a terminal, the copper or copper alloy plate material not requiring a special processing after a crimping process, having a high prolongation effect by suppressing a corrosion reaction, not causing a peel-off of a surface coating layer in the crimping process, and being preferable as a terminal material.SOLUTION: A manufacturing method of copper or a copper alloy plate material includes: a blast treatment process in which a surface of a plate material composed of copper or copper alloy raw material having a Sn layer as a most surface layer is blast-treated such that an area rate to be treated is 75% or more and an arithmetic average roughness Ra is 0.2 μm or more and 3.0 μm or less; and a flame spray process in which a Zn layer or a Zn alloy layer is formed by a flame spray such that an average thickness of the Zn layer or the Zn alloy layer is 5 μm or more and 80 μm or less.SELECTED DRAWING: None
Inventors:
Hiroto Narie
Yuta Sonoda
Yuta Sonoda
Application Number:
JP2016196593A
Publication Date:
April 07, 2021
Filing Date:
October 04, 2016
Export Citation:
Assignee:
DOWA Metal Tech Co., Ltd.
International Classes:
C23C4/08; C23C4/02; C23C4/131; C23C28/02; H01B5/02; H01B13/00; H01R4/18; H01R4/62; H01R13/03
Domestic Patent References:
| JP2016518528A | ||||
| JP2015191776A | ||||
| JP7145489A | ||||
| JP3247779A | ||||
| JP2005108445A | ||||
| JP2014062322A |
Foreign References:
| US20110014825 | ||||
| CN206962034U |
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Yoshihiro Nagare
Naoko Matsuda