To increase the polishing rate of a Cu film with less scratch or dishing and improve the stability in time by using a polishing agent contg. abrasive materials selected among silicon dioxide, aluminum oxide, cerium oxide, silicon nitride and zirconium oxide, Fe (III) compd: and water.
The polishing compsn. is prepared by mixing abrasive materials selected among silicon dioxide, aluminum oxide, cerium oxide, silicon nitride and zirconium oxide with water at desired ratio, dispersing and dissolving an Fe (III) compd. The dispersing or dissolving of these components in water may use e.g. a blade type stirrer to stir or ultrasonic dispersion. The Fe (III) compd. is a polishing accelerator for chemically accelerating the polishing action but must be dissolved in the compsn. and is pref. an Fe salt.
ITOU SANETOKI
SUZUMURA SATOSHI
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