PURPOSE: To obtain the title copper powder capable of improving storage stability of copper powder itself and resistance to circumference without lowering conductivity and electromagnetic wave shielding effects by applying a specific organometallic compound to the surface of the copper powder.

CONSTITUTION: The aimed copper powder obtained by applying a organometallic compound obtained by acylating a mixture of tetraalkoxyzirconium and tetraalkoxytitanium with isostearic acid or oleic acid to the surface of copper powder. The copper powder is blended with a resin binder and solvent to provide the electrically conductive coating composition.