COVER TAPE, METHOD FOR MANUFACTURING COVER TAPE AND ELECTRONIC COMPONENT PACKAGE

Title:

COVER TAPE, METHOD FOR MANUFACTURING COVER TAPE AND ELECTRONIC COMPONENT PACKAGE

Document Type and Number:

Japanese Patent JP2014031197

Kind Code:

A

Abstract:

To provide a cover tape for packaging an electronic component capable of sufficiently reducing loosening of a cover tape occurring during heat sealing, capable of sufficiently suppressing elongation of a cover tape in peeling from a carrier tape and further capable of sufficiently suppressing a dimensional change of a cover tape before and after heat sealing.

There is provided a cover tape for packaging an electronic component which comprises a base material layer, a seal layer and an intermediate layer provided between the base material layer and the seal layer. The base material layer contains a polypropylene-based resin in a proportion of 50 mass% or more and has at least a rigid layer containing a polyamide-based resin as the intermediate layer, the thermal shrinkage in the width direction is 5% or less at 80°C and 10 to 30% at 130°C, and the yield point load in the length direction is 15 N or more.

Inventors:

MASAKI ONORI
MATSUKI YUTAKA

Application Number:

JP2012172752A

Publication Date:

February 20, 2014

Filing Date:

August 03, 2012

Export Citation:

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Assignee:

ASAHI KASEI CHEMICALS CORP

International Classes:

B65D73/02; B32B27/32; B65D65/40; B65D85/86

Domestic Patent References:

JP2011162228A	2011-08-25
JP2012012033A	2012-01-19
JP2006198769A	2006-08-03

Foreign References:

US5447784A

1995-09-05

Attorney, Agent or Firm:

Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Nishimoto

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