Title:
COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2004025483
Kind Code:
A
Abstract:
To provide a cover tape, the separation strength of which is neither too strong nor too weak, small in the difference between the maximum and minimum values of the separation strength, and excellent in static electricity property.
The cover tape can be heat-sealed with a plastic carrier tape, on which storage pockets for storing electronic components are continuously formed. The cover tape comprises at least two layers of a heat sealing material layer B and a base material layer A from the side where the cover tape is heat-sealed with the plastic carrier tape, and has an antistatic agent layer 8 on the layer B, with its surface resistance value on the surface set to 1×1012Ω/S (S is cross sectional area) or less.
Inventors:
NAKANISHI HISAO
Application Number:
JP2002181553A
Publication Date:
January 29, 2004
Filing Date:
June 21, 2002
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
B65D73/02; B32B7/02; B32B7/10; B32B27/00; B65D65/40; B65D85/86; (IPC1-7): B32B7/02; B32B7/10; B32B27/00; B65D65/40; B65D73/02; B65D85/86
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