Title:
CREAM SOLDER EVALUATION DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP3672430
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a cream solder evaluation device and a method, wherein the characteristics, especially printing characteristics of cream solder can be easily and reproducibly evaluated, and the behavior of cream solder can be confirmed when it is printed.
SOLUTION: A cream solder evaluation device is equipped with an evaluation frame 6 that is provided with an opening 6a through which cream solder 5 is filled up and feeds the cream solder 5 on a detachable board 3, a drive mechanism 7 which lifts up the evaluation frame 6 at a prescribed speed, and a load detection sensor 9 which is provided between the evaluation frame 6 and the drive mechanism 7 to detect a load generated when the evaluation frame 6 is lifted up.
More Like This:
| JPH07106626 | [Title of Invention] Printing Machine |
| JPS5812394 | SCREEN PRINTING METHOD |
| WO/1990/011891 | STENCIL PRINTING MACHINE |
Inventors:
Tetsuo Fukushima
Akio Furusawa
Akio Furusawa
Application Number:
JP1977398A
Publication Date:
July 20, 2005
Filing Date:
January 30, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B41F15/08; B23K1/00; B23K35/22; B41F15/36; G01B11/24; G01L5/00; H05K3/34; (IPC1-7): H05K3/34; B23K1/00; B23K35/22; B41F15/08; B41F15/36; G01B11/24; G01L5/00
Domestic Patent References:
| JP7072064A | ||||
| JP6336005A | ||||
| JP8201250A | ||||
| JP1200698A | ||||
| JP8001907A |
Attorney, Agent or Firm:
Ryuji Higashijima
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