To effect high accurate printing and to prevent the development of a defective solder bridge even after reflowing by obtaining a cream solder composed of powdery solder and liquid or pasty flux and adding a glycol base solvent and a hydroxystearic amide base compound in the flux.

In the flux of the cream solder in which the powdery solder and the liquid or basty flux are mixed, the hydroxystearic amide base compound N,N'-orefinebis (12-hydroxystearic amide) is incorporated as thixo-agent and further, glycol base solvent is incorporated. The amide base compound is one component base and stable compound and the material characteristic of viscosity, thixotropy index, etc., can be uniformized. Further, since the glycol base solvent has low viscosity, the vol. of the flux accepted in the cream solder is reduced and restrains the slump of the cream solder at the time of preheating and has such action as to prevent the solder bridge.