Title:
低温デバイスの熱化のための極低温包装
Document Type and Number:
Japanese Patent JP7479404
Kind Code:
B2
Abstract:
A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
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Inventors:
Jinka, Obres
Olivadese, Salvatore, Bernardo
Heart, scene
Bron, Nicholas, Torayf
Butterfly, jerry
Blink, Marcus
Guman, Patrik
Bogolin, Daniela and Florentina
Olivadese, Salvatore, Bernardo
Heart, scene
Bron, Nicholas, Torayf
Butterfly, jerry
Blink, Marcus
Guman, Patrik
Bogolin, Daniela and Florentina
Application Number:
JP2021574218A
Publication Date:
May 08, 2024
Filing Date:
June 19, 2020
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
International Classes:
H01L23/36; H01L23/34; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2016131218A | ||||
| JP2019041014A | ||||
| JP2012060132A | ||||
| JP2001284503A | ||||
| JP2014143305A | ||||
| JP2009253236A | ||||
| JP2016048728A |
Foreign References:
| WO2018231212A1 | ||||
| WO2018125604A1 | ||||
| US10269678 | ||||
| WO2016104777A1 |
Attorney, Agent or Firm:
Tadashi Taneichi