Title:
硬化性組成物、高分子機能性硬化物、高分子機能性膜を備えたスタックもしくは装置、アミド化合物およびその製造方法
Document Type and Number:
Japanese Patent JP6511453
Kind Code:
B2
Abstract:
A curable composition that comprises an amide compound, said amide compound being represented by general formula (1) and having a sulfonic acid density of 3.9 meq/g or greater, a cured product of a functional polymer, a stack or device provided with a functional polymer film, an amide compound, and a method for producing the same.
wherein: m is an integer of 1 or greater; n is an integer of 2 or greater; L 1 represents an (m+1)-valent linking group; L 2 represents an n-valent linking group; R 1 represents a hydrogen atom or an alkyl group; R 2 represents -SO 3 - M + or -SO 3 R 3 (wherein: R 3 represents an alkyl group or an aryl group), provided that when there are two or more R 2 's, all of R 2 's do not represent -SO 3 R 3 at the same time; and M + represents a hydrogen ion, an inorganic ion or an organic ion.
Inventors:
Yusuke Iizuka
Satoshi Sano
Keisuke Kodama
Sotaro Inomata
Shincho Kuniyuki
Satoshi Sano
Keisuke Kodama
Sotaro Inomata
Shincho Kuniyuki
Application Number:
JP2016545054A
Publication Date:
May 15, 2019
Filing Date:
July 22, 2015
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
C08F222/38; B01D61/46; B01D71/40; C07C309/15; C07C309/51; H01M8/02; H01M8/10
Domestic Patent References:
| JP2005514338A | ||||
| JP2009079338A |
Attorney, Agent or Firm:
Patent corporation Iida and Partners
Toshizo Iida
Shuichi Akabane
Toshizo Iida
Shuichi Akabane