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Title:
CURABLE COMPOSITION
Document Type and Number:
Japanese Patent JPH0665464
Kind Code:
A
Abstract:

PURPOSE: To improve solvent resistance and impact resistance after curing in a silicon-containing resin having excellent flexibility and storage stability.

CONSTITUTION: This curable composition consists of a silicon-containing resin and an organometallic compound. The silicon-containing resin is obtained by polymerizing (1) a (meth)acrylic acid ester or a styrene and then copolymerizing (2) a vinyl group-containing silane compound monomer with (3) a carboxylic acid group-containing monomer. Solvent resistance and impact resistance can be improved without damaging flexibility and storage stability.


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Inventors:
MATSUMURA KOUZABUROU
KAKIUCHI HIDEAKI
WATANABE KENICHI
Application Number:
JP24566592A
Publication Date:
March 08, 1994
Filing Date:
August 21, 1992
Export Citation:
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Assignee:
CHISSO CORP
International Classes:
C08K5/56; C08K5/49; C08L51/00; C08L51/06; (IPC1-7): C08L51/00; C08K5/56
Attorney, Agent or Firm:
Katsuhiko Nonaka



 
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