Title:
硬化性組成物、ドライフィルム、硬化物および電子部品
Document Type and Number:
Japanese Patent JP7418985
Kind Code:
B2
Abstract:
To provide a curable composition capable of obtaining a cured product which contains a thermosetting polyphenylene ether soluble in various solvents and has excellent dielectric properties and self-extinguishing properties.SOLUTION: There is provided a curable composition which comprises a polyphenylene ether comprising raw material phenols containing phenols (A) satisfying both at least the following condition 1 and the following condition 2, or, a mixture of phenols (B) which satisfy at least the following condition 1 and do not satisfy the following condition 2 and phenols (C) which do not satisfy the following condition 1 and satisfy the following condition 2 and silica. (Condition 1) Having hydrogen atoms at the ortho-position and the para-position. (Condition 2) Having a functional group which has a hydrogen atom at the para-position and contains an unsaturated carbon bond.SELECTED DRAWING: None
Inventors:
Asami Nozaka
Satoko Matsumura
Nobuhiro Ishikawa
Satoko Matsumura
Nobuhiro Ishikawa
Application Number:
JP2019132313A
Publication Date:
January 22, 2024
Filing Date:
July 17, 2019
Export Citation:
Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
C08L71/12; B32B27/00; B32B27/18; C08J5/18; C08J5/24; C08K3/36; C08L21/00
Domestic Patent References:
| JP4234430A | ||||
| JP2000104014A | ||||
| JP2011001473A | ||||
| JP2010111758A | ||||
| JP2004339342A | ||||
| JP2004339343A |
Foreign References:
| WO2016033156A1 | ||||
| US20030225220 | ||||
| WO2017126417A1 |
Attorney, Agent or Firm:
Atsushi Ito