Title:
CURABLE EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH04154860
Kind Code:
A
Abstract:
PURPOSE:To obtain a curable epoxy resin composition containing an epoxy resin having an aromatic amide structure, polyethersulfone and a specific curing agent and having excellent mechanical characteristics, especially of toughness, adhesivity, etc. CONSTITUTION:The objective composition consisting of (A) 100 pts.wt. epoxy resin expressed by formula I (R1 is formula II or formula III; R2 is H or methyl; (n) is >=0), e.g. obtained by reaction of a phenol compound obtained by reacting terephthalic acid dichloride with p-aminophenol in an amide based solvent with epihalohydrin, preferably epoxy resin expressed by formula IV, (B) 5-70 pts.wt. polyethersulfone expressed by formula V ((m) is 5-500) and (C) 10-40 pts.wt. one or more kinds of curing agents selected from an aliphatic amine, aromatic amine, acid anhydride and a compound (e.g. diamine or diaminodiphenylmethane) expressed by formula IV (A is O, CH2 or SO2).
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Inventors:
FUKUI TAKAYUKI
NANBU YOKO
ENDO TAKESHI
INOUE TAKASHI
NANBU YOKO
ENDO TAKESHI
INOUE TAKASHI
Application Number:
JP28110290A
Publication Date:
May 27, 1992
Filing Date:
October 19, 1990
Export Citation:
Assignee:
ASAHI DENKA KOGYO KK
International Classes:
C08L63/00; C08G59/00; C08G59/28; C08G59/30; C08G59/50; C08L81/00; C08L81/06; (IPC1-7): C08G59/30; C08G59/50; C08L63/00; C08L81/06
Attorney, Agent or Firm:
Kaoru Furuya (3 outside)