Title:
CURABLE RESIN COMPOSITION AND METHOD OF COATING THEREWITH
Document Type and Number:
Japanese Patent JP3517893
Kind Code:
B2
Abstract:
PURPOSE: To obtain a curable resin composition which can give a coating film excellent in low-temperature curability and acid resistance by using a specified vinyl copolymer and a specified compound as the essential components.
CONSTITUTION: The composition is produced by using a vinyl copolymer having at least one siloxy group and at least one epoxy group in the molecule (e.g. triethylsiloxy-ethyl methacrylate/styrene/n-butyl methacrylate/n-butyl acrylate/ glycidyl methacrylate copolymer) and a compound having at least two acid anhydride groups in the molecule (e.g. styrene/n-butyl methacrylate/itaconic anhydride copolymer) as the essential components.
Inventors:
Azuma, Ichiro
Iwamura, Goro
Iwamura, Goro
Application Number:
JP8446893A
Publication Date:
April 12, 2004
Filing Date:
April 12, 1993
Export Citation:
Assignee:
DAINIPPON INK & CHEM INC
International Classes:
B05D1/38; B05D7/24; C08G59/42; C08L101/00; C08L101/02; C08L101/10; C09D157/04; C09D163/00; C09D167/00; (IPC1-7): C08G59/42; B05D7/24
Attorney, Agent or Firm:
高橋 勝利
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