Title:
CUTTER FOR SEMICONDUCTOR WAFER, AND METHOD OF CUTTING SEMICONDUCTOR WAFER USING THE SAME
Document Type and Number:
Japanese Patent JP2002252187
Kind Code:
A
Abstract:
To simply and quickly provide a cutter for a semiconductor wafer which can prevent the pollution of the surface and can cut out a semiconductor wafer.
A semiconductor wafer is installed in a cavity 5. The guide 3 of a roller (curved-surface body) is engaged with a groove 8, and the roller 1 is turned once in the depth direction, while being pressed from this side of a wafer stage 4. A projection presses the wafer in the order at two places on the same cleavage line and cuts it out.
Inventors:
SHIROMIZU TATSUYA
Application Number:
JP2001052180A
Publication Date:
September 06, 2002
Filing Date:
February 27, 2001
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B26F1/20; B28D5/00; H01L21/301; (IPC1-7): H01L21/301; B26F1/20; B28D5/00
Attorney, Agent or Firm:
Kaneo Miyata (1 person outside)
Previous Patent: CUTTER FOR SEMICONDUCTOR WAFER
Next Patent: POLISHING LIQUID FOR SEMICONDUCTOR WAFER
Next Patent: POLISHING LIQUID FOR SEMICONDUCTOR WAFER